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Assembly Tools
By Charles Moncavage
General Manager
Ovation Products


Why Is Board Support Necessary in the Lead-free Process?


Aside from the fact that higher temperatures through the reflow process will induce PCB warpage, bottom-side support becomes a key factor when considering the requirement for “complete gasketing” of the board to stencil when using lead-free pastes. Variations in the planarity of the PCB during the print are an open invitation for bridging and other similar print defects that are more common in the lead-free environment.


 

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Last Updated:
November 28, 2006


Copyright © 2006


Publisher: Megan Wendling
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