Q&A Reflow Soldering Vol.6

Reflow Soldering

By Rob DiMatteo,
BTU International

What Considerations Are Necessary to Determine Existing Reflow Oven Lead-free Readiness?

While reflow oven manufacturers would like to say that you need a new oven with all the latest features, the answer depends on the quality of the oven and the tradeoffs you are willing to make. If the oven was inexpensive and just barely adequate for processing eutectic solder, it will not work for lead-free solder. If it is an oven featuring sufficient power, excellent temperature control of both the heating and cooling sections, and the ability to work at higher temperatures, you can probably use it. Ovens in between may be able to be upgraded with simple kits (consult with the manufacturer) or can be used if you process less complex and light boards. The following checklist highlights the attributes one needs to look at when evaluating an oven for lead-free processing.
Oven attributes to consider for lead-free processing:
1. Temperature Capability: Minimum 325°C
2. Precision Temperature Control: Uniformity
3. Convection Control: Closed-loop control for repeatability
4. Throughput: Heated length and conveyor speed
5. Atmosphere Requirements: Air or Nitrogen
6. Flux Management: Efficiency
7. Cooling Capacity: Exit temperature and cooling rate
8. Cost of Ownership: Throughput, power and nitrogen consumption

• Guest Commentary

• Assembly Tools

• Cleaning Agents

• Cleaning Equipment

• Components

• Dispensing

• Inspection

• Press-Fit Component
Technologies

• Product Identification

• Reflow Soldering

• Rework & Repair

• Selective Soldering

• Solder Materials

• Solder Recovery

• Stencil Printing

• Thermal Process

• Wave Soldering

• X-ray Inspection

Leadfreemagazine.com is brought to you by a consortium of leading companies in the industry: Aqueous Technologies, BTU International, Creative Automation, DEK, ESSEMTEC, EVS International, Kester, KIC, Kyzen, MVP, Ovation Products, Polyonics, Practical Components, TYCO, and VJ Electronix

Last Updated:
May 17, 2006

Publisher: Megan Wendling