Leadfreemagazine Home Page Vol6

• Guest Commentary

• Assembly Tools

• Cleaning Agents

• Cleaning Equipment

• Components

• Dispensing

• Inspection

• Press-Fit Component
Technologies

• Product Identification

• Reflow Soldering

• Rework & Repair

• Selective Soldering

• Solder Materials

• Solder Recovery

• Stencil Printing

• Thermal Process

• Wave Soldering

• X-ray Inspection

Leadfreemagazine.com is brought to you by a consortium of leading companies in the industry: Aqueous Technologies, BTU International, Creative Automation, DEK, ESSEMTEC, EVS International, Kester, KIC, Kyzen, MVP, Ovation Products, Polyonics, Practical Components, TYCO, and VJ Electronix

		Guest Commentary: Lead-Free Conundrum Ray Prasard Ray Prasard Consultancy Group + View Commentary



			*Advantages and Disadvantages of AOI Methodologies in Lead-Free PCB Assembly* Ren Yang MVP Corporation + View Article** (PDF)



			Quality Issues Related to the Breach of Lead-Free Thermal Process Window Miles Moreau KIC + View Article (PDF)



			Cleaning Issues Associated with Lead Free Soldering Materials Phase II Thomas M. Forsythe Vice President Kyzen Corporation + View Article (PDF)



			New Trends for PWB Surface Finishes in Mobile Phone Applications Claus Würtz Nielsen Nokia Danmark A/S Dr. Anette Alsted Rasmussen Technical University of Denmark Associate Professor Rajan Ambat IPL, Technical University of Denmark Professor Per Møller IPL, Technical University of Denmark + View Article (PDF 1.5MB)










			Pb-Free BGA Solder Ball Attach Assembly Research: A Retrospective of 5 Years of Study. Amol Kane, D.L. Santos and Vatsal Shah Systems Science and Industrial Engineering Department Binghamton University + View Article (PDF)




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Wendling Associates
2 Crooked Lane
Naples, FL 34112

Last Updated:
November 29, 2006

Publisher: Megan Wendling