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• Guest Commentary |
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• Solder
Materials (pdf) |
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• Stencil Printing |
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• Dispensing |
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• Wave Soldering |
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• Selective Soldering |
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• Hand Soldering |
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• Thermal
Process |
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• Cleaning Equipment |
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• Product Identification |
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• Cleaning
Agents |
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• Press-Fit
Component
Technologies |
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• Components |
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• Inspection |
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| Leadfreemagazine.com
is brought to you by a consortium of leading companies
in the industry: Aqueous Technologies, ASAT, Creative
Automation, DEK, EPM-IBL, Kester, KIC, Kyzen, Metcal,
MVP Inc., Polyonics and Tyco Electronics
Automation. |
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Stencil
Printing
By
Rich Heimsch
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What are
your views of the impact of lead-free adoption on the
pre-placement process?
DEK has been studying the print process impact of lead-free
implementation for a number of years now, and continues
to conduct follow-up research in order to be able to provide
a complete and interacting Pre-placement process.. optimized
machine configurations, optimized operating parameters,
and optimized stencil materials, manufacturing methodology
and pattern design. We utilize pastes from a worldwide
variety of sources and publish our findings on a continuous
basis. We have definitely seen there to be differences
in the imaging characteristics of lead-free materials and
our ongoing process development research is focused upon
further quantifying those differences and providing documented
solutions for dealing with those differences.
For instance, a paper we published in 2002 that investigated
mass imaging of lead free materials in enclosed print heads
compared critical print characteristics of three lead free
materials to those of a common lead rich material. It identified
several significant differences, including a measurable and
consistent difference in the release efficiency between the
lead free and lead rich materials. Briefly summarized, the
volume deposited for lead free was reduced on average by
15%. Since then numerous additional paste types have been
compared and their characteristics quantified in a similar
manner. Additionally, the data collection has been extended
to measure the effect of various stencil technologies and
imaging techniques, including our patented Vector Guard stencils,
VAHT (Variable Aperture Height Technology) foils and ProFlow
DirEKt Imaging. Details of these and other Applied Process
Engineering studies are always available at www.dek.com
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