How do the different reflow characteristics of
a lead-free process affect AOI inspection?
Generally, lead-free alloys do not wet as well as a leaded
alloy, this is especially true when the reflow process
does not incorporate an inert atmosphere reflow process.
As a result of the process deviation, the AOI system will
have to be tuned to allow for this change, however the
inspection capabilities will not be affected.
What recommendations can you provide when incorporating
an AOI system into a lead-free manufacturing line?
If possible, nitrogen should be added to the reflow process
to improve the wetting of the solder joints. If this cannot
be implemented, then separate AOI part libraries should
be developed to account for each process.
What impact does a lead-free process have on the capability
and/or performance of an AOI system?
For AOI systems utilizing rules based inspection algorithms
the impact is insignificant since the algorithms can be
tuned to accommodate the differences between the two processes.
From a performance perspective, once the algorithms are
tuned, the performance levels should remain consistent
between the two processes.
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