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		What lead-free solder alloys are recommended for reflow soldering?

		What are the main qualification tests for using lead-free solder paste?

		Will the stencil design or printing process need to be changed for lead-free?

		In what way does a lead-free thermal profile differ from a traditional tin-lead process?

		Should a nitrogen atmosphere be used in the reflow process?

		Will the higher temperatures needed for melting lead-free solder create more fumes and condensate in the reflow oven?

		Will residues from lead-free, water-soluble paste be more difficult to remove?

		What happens to no-clean flux residues at the higher reflow temperatures?

		Is the appearance of the lead-free solder joints different from those made with tin-lead solder?

		What are the main soldering defects associated with lead-free reflow soldering?

		What other issues can be expected with the conversion to lead-free reflow soldering?

Last Updated:
November 29, 2006

Publisher: Megan Wendling